Greek: mostly fine, with exceptions
变化四：新兴先进封测技术的兴起CoWoS先进封装可谓HBM的黄金搭档。随着全球对于高性能计算（HPC）及人工智能（AI）芯片需求的持续增长，也推动了对于台积电CoWoS（Chip on Wafer on Substrate）先进封装产能的需求暴涨，虽然台积电持续扩大产能，但依然难以满足市场需求，成为了限制HPC及AI芯片产能的另一关键瓶颈。这也使得部分客户考虑寻求台积电CoWoS以外的替代方案，其中就包括英特尔的EMIB-T先进封装技术。
。业内人士推荐夫子作为进阶阅读
But more than that, they taught me how much more fun it was to learn by playing with an interactive, dynamic program instead of passively reading about concepts in a book. […]
此事还冲上微博热搜，引发了公众对国内手机测评行业生存现状的集体反思。
But building HS2 has changed the landscape along its route, cutting into fields and communities, and dividing opinion.